Evaluation of Candida Albicans Biofilm Formation on Various Parts of Implant Material Surfaces

  • C Gökmenoğlu
  • NB Kara
  • M Beldüz
  • A Kamburoğlu
  • İ Tosun
  • E Sadik
  • C Kara
Keywords: Biofilm, Candida albicans, implant


Aims: Candida albicans adhesion to any oral substrata is the first and essential stage in forming a pathogenic fungal biofilm. In general, yeast cells have remarkable potential to adhere to host surfaces, such as teeth or mucosa, and to artificial, non-biological surfaces, such as dental materials. C. albicans adhesion to denture materials is widely recognized as the main reason for the development of stomatitis. This study compared the susceptibility of different parts of the implant system with C. albicans adhesion. Material and Methods: Each material maintained contact with C. albicans suspension, and biofilm formations around the implant materials were evaluated. To evaluate the biofilm formation, the XTT technique and scanning electron microscopy (SEM) were used. Results: In general, a fine biofilm layer of C. albicans species was found on the surface of all examined materials. However, when examining the SEM images, candidal growth was significantly lower on the surfaces of the gingival former, abutment, and machined surface implant samples. According to the colorimetric assay (XTT), the gingival former samples revealed the lowest quantity of biofilms formed (median XTT value, 0.0891) (P < 0.001). The abutment and machined surface implant samples had low XTT values with similar values. The highest median colorimetric XTT values (0.1741), significantly higher than those of the other materials (P < 0.001), were for the bone level implant samples. Conclusions: This finding emphasizes implant treatment would be chosen complacency in patients who are prone to oral candidosis, medically compromised patients under immunosuppression, and patients with tumor who are being treated with chemotherapy or radiation.

Keywords: Biofilm, Candida albicans, implant


Journal Identifiers

eISSN: 2229-7731
print ISSN: 1119-3077