Impact resistance and electrical conductivity of copper nanoparticle-Milicia excels sawdust composites

  • D Gyasi-Antwi
  • A.O. Boansi
  • P.K. Mensah
Keywords: Cu(NPs), Ascorbic Acid, FTIR Spectroscopy, Polyvinyl Formal, Impact Test, Electrical Resistivity

Abstract

Copper nanoparticles (Cu(NPs)) prepared by chemical reduction of cupper (II) sulphate pentahydrate using ascorbic acid were blended with Milicia excels (Odum) sawdust and Polyvinyl Formal/Calcium Carbonate wood adhesive as matrix to produce rectangular slabs of nano-composites with potential applications for industrial pack-aging or building panelling. The nano-composites were characterized by Fourier Transform Infrared (FTIR) Spec-troscopy, and hydroxyl (OH) groups -CH2- (Alkane groups), C=C (Alkene or Aromatic groups), C-O (Carbonyl) groups of lignin, cellulose or hemicelluloses or C-O-C Ester groups of cellulose and hemicelluloses were identifi-ed. The mechanical toughness of the nano-composites were tested to determine the impact resistance, using Tinius Olsen IT 406 High Energy Pendulum Impact Machine. The impact energy of 26.89 ± 0.02 J exceeded values for individual constituents of the composites, was comparable to natural fibre reinforced composites, and the nano-composites could serve as panelling or packaging materials. The electrical characteristics of the nano-composites were examined by determining the electrical conductivity, resistivity and electric field strength, using simple dire-ct current Ohms bridge, and the values were respectively, (1.73 ± 0.05) x 10-2 ohm-1 m-1, 57.8 ± 0.5 Ω m, and 186.3 ± 0.5 V m-1. The low value of electrical conductivity was suggestive that the Cu(NP)-sawdust composite could be likened to intrinsic semiconductor, but the process for transition into extrinsic semiconductor was not in-vestigated. The imposed voltage increased with percentage moisture content, presumably due to hydrolyzed bon-ds on the surfaces of the nano-composite. The nano-composites could be used as insulating and packaging materi-als for sensitive electronic equipment.

Keywords: Cu(NPs), Ascorbic Acid, FTIR Spectroscopy, Polyvinyl Formal, Impact Test, Electrical Resistivity

Published
2020-01-29
Section
Articles

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eISSN: 0855-2215